Hardware & Embedded Engineering Internships

Hardware and embedded engineering internships: firmware and embedded software, FPGA and ASIC design, analog, digital and memory chip design, verification, validation and test, and electrical and electronics engineering. This page also covers the physical engineering disciplines, such as mechanical and product design engineering, thermal, propulsion, structures, avionics, RF, signal processing and optics, which make up a large share of aerospace, automotive and semiconductor internships, and quantum computing roles.

Open now: 550 for Summer 2027, 54 for Spring 2027, 37 for Winter 2027 and 13 for Fall 2027. Latest postings from Schweitzer Engineering Laboratories, Rockwell Automation and Northrop Grumman.