| Micron Technology | Intern - Memory Design Engineer, HBM | Richardson, TX | Hardware / Embedded | Summer 2027 | 1d | |
| Micron Technology | Intern - DRAM Customer Enablement Engineering | Boise, ID | Hardware / Embedded | Summer 2027 | 1d | |
| Micron Technology | Intern - Equipment Engineer | Manassas, VA | Manufacturing / Industrial | Summer 2027 | 4d | |
| Micron Technology | Intern - Yield Enhancement Engineer | Boise, ID | Manufacturing / Industrial | Summer 2027 | 5d | |
| Micron Technology | Intern - ID1 ATE PI Engineer | Boise, ID | Hardware / Embedded | Summer 2027 | 5d | |
| Micron Technology | Intern - SSD Hardware Engineering | Longmont-MAX, CO | Hardware / Embedded | Summer 2027 | 5d | |
| Micron Technology | Intern - SSD Firmware - CICD | Longmont-MAX, CO | Hardware / Embedded | Summer 2027 | 8d | |
| Micron Technology | Intern - SMAI TD AI Engineering Team | Boise, ID | Data Science / ML | Summer 2027 | 12d | |
| Micron Technology | Intern - Next Gen HBM Platform Arch | Folsom, CA | Hardware / Embedded | Summer 2027 | 12d | |
| Micron Technology | Intern - Engineer, HIG HBM DTPCO | Richardson, TX | Hardware / Embedded | Summer 2027 | 12d | |
| Micron Technology | Intern - ID1 Manufacturing Engineer | Boise, ID | Manufacturing / Industrial | Summer 2027 | 12d | |
| Micron Technology | Intern - Design Engineer, HBM | Richardson, TX | Hardware / Embedded | Summer 2027 | 13d | |
| Micron Technology | Intern - Memory Design Engineer, HBM | Richardson, TX | Hardware / Embedded | Summer 2027 | 13d | |
| Micron Technology | Intern - ATE Process Engineer | Boise, ID | Manufacturing / Industrial | Summer 2027 | 16d | |
| Micron Technology | Intern - ATE Process Engineer | Boise, ID | Manufacturing / Industrial | Summer / Spring 2027 | 16d | |
| Micron Technology | Intern - Semiconductor Research & Technology Development | Albany, NY | Hardware / Embedded | Summer 2027 | 16d | |
| Micron Technology | Intern - HBM Design Development Technical Leadership (DDTL) | Richardson, TX | Hardware / Embedded | Summer 2027 | 19d | |
| Micron Technology | Intern – Memory Systems Architecture & AI | San Jose, CA | Data Science / ML | Summer 2027 | 19d | |
| Micron Technology | Intern - ASIC Validation | Minneapolis, MN | Hardware / Embedded | Summer 2027 | 23d | |
| Micron Technology | Intern - ID1 Process Engineer | Boise, ID | Manufacturing / Industrial | Summer 2027 | 24d | |
| Micron Technology | Intern - ID1 Equipment Engineer | Boise, ID | Manufacturing / Industrial | Summer 2027 | 24d | |
| Micron Technology | Intern Design Engineer - HIG HBM | Richardson, TX | Hardware / Embedded | Summer 2027 | 24d | |
| Micron Technology | Intern - Design Engineer, HIG HBM | Richardson, TX | Hardware / Embedded | Summer 2027 | 25d | |
| Micron Technology | Intern - ATE Process Engineer | Boise, ID | Manufacturing / Industrial | Summer / Spring 2027 | 26d | |
| Micron Technology | Intern - Probe Equipment Engineer | Boise, ID | Manufacturing / Industrial | Summer 2027 | 26d | |
| Micron Technology | Intern – DRAM Technology Physical Design and Block-Level PPA Optimization | Boise, ID | Hardware / Embedded | Summer 2027 | 26d | |
| Micron Technology | Intern- ID1 Equipment Engineer | Boise, ID | Manufacturing / Industrial | Summer 2027 | 26d | |
| Micron Technology | Intern - Design Engineer, HBM | Richardson, TX | Hardware / Embedded | Summer 2027 | 26d | |
| Micron Technology | Intern - Probe Manufacturing Engineering (Probe AME) | Boise, ID | Manufacturing / Industrial | Summer 2027 | 26d | |
| Micron Technology | Intern - TSE KEG Engineer | Boise, ID | Manufacturing / Industrial | Summer 2027 | 29d | |
| Micron Technology | Intern - ASIC Digital Design | Minneapolis, MN | Hardware / Embedded | Summer 2027 | 29d | |
| Micron Technology | Intern - Data Center SSD Firmware | Longmont-MAX, CO | Hardware / Embedded | Summer 2027 | 30d | |
| Micron Technology | Intern – Process Engineer | Boise, ID | Manufacturing / Industrial | Summer 2027 | 30d | |