Summer 2027 - Mechanical Engineering Internship

Job description

Please Note: To conform with the United States Government Space Technology Export Regulations, the applicant must be a U.S. citizen, lawful permanent resident of the U.S., conditional resident, asylee or refugee (protected individuals as defined by 8 U.S.C. 1324b(a)(3)), or eligible to obtain the required authorizations from the U.S. Department of State. At CesiumAstro, we are developers and pioneers of out-of-the-box communication systems for satellites, UAVs, launch vehicles, and other space and airborne platforms. We take pride in our dynamic and cross-functional work environment, which allows us to learn, develop, and engage across our organization. If you are looking for hands-on, interactive, and autonomous work, CesiumAstro is the place for you. We are actively seeking passionate, collaborative, energetic, and forward-thinking individuals to join our team. The CesiumAstro mechanical team is looking for Summer 2027 interns to design and build space structures and thermal systems for satellite communication systems. Mechanical systems interns will work closely with CesiumAstro engineers on product development, design, test, and manufacturing of structures and thermal systems for space communication systems. Areas of focus will include design of conduction-cooled packaging, deployable structures and mechanisms, and lightweight composite space structures. Assignments will be determined by a mix of project availability and the interests of the successful candidates. CesiumAstro interns regularly present their work to peers, mentors, and CesiumAstro executive leadership throughout the course of the summer. As such, excellent written and verbal communication skills are required. To apply, please include a cover letter describing your interest in mechanical systems and either space systems or communication systems. JOB REQUIREMENTS AND MINIMUM QUALIFICATIONS Current enrollment in a Bachelor of Science (BS), Master of Science (MS), or Ph.D. program in Mechanical Engineering or Aerospace Engineering from an accredited university. GPA of 3.5 or higher. Upper-level undergraduate coursework in structures and heat transfer. Experience with mechanical FEA tools, such as SolidWorks Simulation or ANSYS. Excellent written and verbal communication skills. PREFERRED EXPERIENCE Familiarity with electronics assemblies. Experience with EMI/EMC mitigation techniques. Experience with CNC manufacturing. Aerospace or automotive electronics design, development, and qualification.